Thermal Analysis

DESIGN PHASE:       analysis
SUB ELEMENT NAME:   thermal analysis
VARIABLE NAME:      [HEAT]
DATE:               REVISION LETTER:    REVISION DATE: 
APPLICABILITY:      all circuits (with power devices)

ACTIVITY:  Thermal analyis of any devices that require special
heatsinking.

OUTPUT:  Estimated junction or hot spot temperature of power or
power sensitive device.

ALGORITHM:

[HEAT] =            engineering hours for thermal analysis
0.0*                time per device
[POWER DEVICES]     number of devices

DISCUSSION:

Author: Jerrold Foutz, foutz@smpstech.com

Original: Foutz, J., Power Supply Circuit Development Estimating Aid - An Expert System Application, IEEE Applied Power Electronics Conference Record, New Orleans, February 1-5, 1988. Revised 24 February 2001