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Electronic Failure Analysis Handbook : Techniques and Applications for Electronic and Electrical Packages, Components, and Assemblies by Perry L. Martin Hardcover - 750 pages (February 1999) McGraw Hill Text ISBN: 0070410445 Dimensions (in inches): 2.16 x 9.49 x 7.69
Book Description
From the Back Cover
The author, Perry L. Martin, 2/8/99 , February 8, 1999 Part One is the shortest and deals with the uses of electronic failure analysis (EFA). Background on system and component reliability is presented, as well as an entire chapter on the use of EFA in product liability. Part Two deals with the techniques involved in performing EFA. Techniques include: electrical charaterization, x-ray, IR-thermography, acoustic micro-imaging, photography, metallography, etc.. Efforts are made to present information to allow optimization of these techniques for specific technologies. Part Three deals with the failure analysis of specific technologies. This includes: Microelectronics, passive components, connectors, solder joints, switches, high-voltage applications, etc.. The intent is to be as inclusive as possible. I would not attempt to develop such a comprehensive undertaking alone. I called upon the leading experts in their fields to contribute chapters to the handbook and case studies & examples are presented and featured in all three parts of the handbook. These experts did a wonderful job of presenting the material in a useful format. I believe that this handbook will be a valuable addition to the library of anyone who works in or around electronics. I sincerely hope that it serves you well. |
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Electronic Component Reliability : Fundamentals, Modelling, Evaluation, and Assurance (Wiley Series in Quality and Reliability Engineering) by Finn Jensen Paperback - 374 pages (March 1996) John Wiley & Sons ISBN: 0471952966 Dimensions (in inches): 1.08 x 9.83 x 6.78
The publisher, John Wiley & Sons
Booknews, Inc. , August 1, 1996 |
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